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TekniPlex Consumer Products to Host Virtual Product Exhibition

 08/18/2022

TekniPlex, holding company for Dolco Packaging will present a materials science expo on August 31st from 13h00 to 17h00 EST.  The format will involve an immersive cyber experience to demonstrate innovations for foods.  Specific products will be reviewed in "virtual booths" and in breakout sessions.

 

Attendees will have their own avatars and can interact through the virtual exhibits space.

 

Suzanne Shelton, President and CEO of Shelton Group will discuss sustainability in the packaging market.  Joel Morales, Executive Director, Polyolefins for IHS will discuss resin trends in packaging.

 

Information on registration can be obtained from <cdale@turchette.com>.

Download the flyer here